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US$0.10-15.00 / Piece

High End Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias pictures & photos

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What is High End Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias

Name: High End Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias
Uploaded: 2026-01-06T13:28:05+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Exceeding
Transport Package Vacuum Package and Foam Protected
Specification ENIG
Trademark EEG
Origin Shenzhen
Certification RoHS, UL CE, GS, ISO
Delivery 24hours~5 Days
Service 7*24 Hours Online
Price Factory Price
Keyword Custom PCB
Product Name HDI PCB
MOQ 1 PCS
Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
Min. Line Width 0.075mm(3mil)
Copper Thickness 0.5-12oz(18-420um)
Min. Line Spacing 0.075mm(3mil)
Board Thickness 0.2-6.0mm
Surface Finishing Immersion Silver, Tin, Gold /HASL Lead Free
Testing Service 100% E-Testing

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 4.0/5.0

(1 Reviews)

Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Address Rm1107, Building3, Wisdom Field, Biguiyuan, Xingyiroad, Fuyong Street, Baoan Discrict, Shenzhen City.
Main Markets North America, South America, Western Europe
International Commercial Terms(Incoterms) FOB, CFR, CIF, DDP, DAP, EXW
Terms of Payment T/T, PayPal, Western Union, Small-amount payment, VTB
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Motherboard Comparison

	High End Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias Contact Now	Ads1256idbr Ads1256 24-Bit 30ksps Very Low Noise with Multiplexer Chip Contact Now	Quick View Max31865ATP+T Rtd to Digital Converter Chip Contact Now	Quick View Ads1110A0idbvr Ads1110 16-Bit 15sps Delta-Sigma ADC with Internal Reference, PGA and Oscillator I2c Serial Interface Chip Supplier Contact Now	New Original Chip Ad637jrz-Rl Integrated Circuit DC IC Chip Contact Now

Transaction Info
	High End Multi Layer HDI PCB Board and PCB Circuit Board with Blind and Buried Vias Contact Now	Ads1256idbr Ads1256 24-Bit 30ksps Very Low Noise with Multiplexer Chip Contact Now	Quick View Max31865ATP+T Rtd to Digital Converter Chip Contact Now	Quick View Ads1110A0idbvr Ads1110 16-Bit 15sps Delta-Sigma ADC with Internal Reference, PGA and Oscillator I2c Serial Interface Chip Supplier Contact Now	New Original Chip Ad637jrz-Rl Integrated Circuit DC IC Chip Contact Now
Price	US$0.10-15.00 / Piece	US$0.20-0.45 / Piece	US$0.20-0.60 / Piece	US$0.20-0.50 / Piece	US$0.20-0.45 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	RoHS, UL CE, GS, ISO	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; Product Name: HDI PCB; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; Testing Service: 100% E-Testing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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