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US$0.10-10.00 / Piece

Multi Layer High Quality PCB with BGA pictures & photos

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What is Multi Layer High Quality PCB with BGA

Name: Multi Layer High Quality PCB with BGA
Uploaded: 2025-12-23T14:21:35+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Model FR-4
Brand Exceeding
Transport Package Vacuum Package and Foam Protected
Specification PCB customized size
Trademark EEG
Origin Shenzhen
Certification RoHS, UL CE, GS, ISO
Delivery 24hours~5 Days
Service 7*24 Hours Online
Price Factory Price
Keyword Custom PCB
Product Name Multilayer PCB
MOQ 1 PCS
Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
Min. Line Width 0.075mm(3mil)
Copper Thickness 0.5-12oz(18-420um)
Min. Line Spacing 0.075mm(3mil)
Board Thickness 0.2-6.0mm
Surface Finishing Immersion Silver, Tin, Gold /HASL Lead Free
One-Stop Service PCB Assembly, Component Supply
Testing Service 100% E-Testing

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 4.0/5.0

(1 Reviews)

Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Address Rm1107, Building3, Wisdom Field, Biguiyuan, Xingyiroad, Fuyong Street, Baoan Discrict, Shenzhen City.
Main Markets North America, South America, Western Europe
International Commercial Terms(Incoterms) FOB, CFR, CIF, DDP, DAP, EXW
Terms of Payment T/T, PayPal, Western Union, Small-amount payment, VTB
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Motherboard Comparison

	Multi Layer High Quality PCB with BGA Contact Now	Quick View Low-Cost 96CPR Ab Output, Optical Module PCBA and Code Disk Encoder Contact Now	Quick View Differential Ab Output, L-Shaped Optical Module PCBA and Code Disk Encoder Contact Now	Quick View F4btms1000 2-Layer 6.4mm Circuit Board PCB Manufacturing of Shenzhen Electronics Contact Now	Quick View Enig+OSP Hybrid PCB - 1.2mm Thick Cargo Area Lighting Contact Now

Transaction Info
	Multi Layer High Quality PCB with BGA Contact Now	Quick View Low-Cost 96CPR Ab Output, Optical Module PCBA and Code Disk Encoder Contact Now	Quick View Differential Ab Output, L-Shaped Optical Module PCBA and Code Disk Encoder Contact Now	Quick View F4btms1000 2-Layer 6.4mm Circuit Board PCB Manufacturing of Shenzhen Electronics Contact Now	Quick View Enig+OSP Hybrid PCB - 1.2mm Thick Cargo Area Lighting Contact Now
Price	US$0.10-10.00 / Piece	US$1.53-1.81 / Piece	US$2.51-2.79 / Piece	US$0.90-99.99 / PCS	US$0.80-2.60 / Piece
Min Order	1 Piece	200 Pieces	200 Pieces	1 PCS	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal	T/T, PayPal	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T, Western Union
Quality Control
Product Certification	RoHS, UL CE, GS, ISO	-	-	-	-
Management System Certification	-	ISO9001:2015	ISO9001:2015	-	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Western Europe	Domestic	Domestic	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: 1-3 months Off Season Lead Time: one month	Peak Season Lead Time: 1-3 months Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Model: FR-4; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; Product Name: Multilayer PCB; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; One-Stop Service: PCB Assembly, Component Supply; Testing Service: 100% E-Testing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Model: RS7227-96; Brand: Raysilicon; Powersupply: 2.7-5.5V; Currentconsumption: 16mA; Maximumspeed: 2000rpm; Incrementaloutputs: a B; Operatingandstorage: -40°c~85°c; Radialtolerance: ±0.3mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Model: PCB; Brand: Raysilicon; Powersupply: 2.7-5.5V; Currentconsumption: 16mA; Maximumspeed: 2000rpm; Incrementaloutputs: a B; Operatingandstorage: -40°c~85°c; Radialtolerance: ±0.3mm;	Type: Rigid Circuit Board; Dielectric: F4btms1000; Material: Ceramic-Filled PTFE Composite; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Model: PCB; Brand: Wangling; Surface Finish: Bare Copper; Board Thickness: 6.4mm (Finished); Layer Count: 2-Layer; Solder Mask: None;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Jiangsu Raysilicon Technologies Co. Ltd	Jiangsu Raysilicon Technologies Co. Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Jiangxi Hongyu Circuit Technology Co., Ltd.
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