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      Multilayer PCB
      US$0.10-15.00 / Piece
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      What is Printed Circuit Boards Multilayer Immersion Gold PCB with Buried Vias

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-15.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Exceeding
      • Transport Package Vacuum Package and Foam Protected
      • Specification Customized
      • Trademark EEG
      • Origin Shenzhen
      • Certification RoHS, UL CE, GS, ISO
      • Delivery 24hours~5 Days
      • Service 7*24 Hours Online
      • Price Factory Price
      • Keyword Custom PCB
      • MOQ 1 PCS
      • Min. Line Spacing 0.075mm(3mil)
      • Copper Thickness 18um-3500um(0.5- 100oz)
      • Min. Line Width 0.075mm(3mil)
      • Min Hole Size 0.1mm(4mil)
      • Testing Service 100% E-Testing
      • Board Thickness 0.2-6.0mm
      • Industrial Industrial Control Board, Motherboard
      • Surface Finishing Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP
      • Solder Mask Green, White, Black, Blue, Red(Customized)

      Product Description

      Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

      Learn More

      Multilayer PCB Comparison
      Transaction Info
      Price US$0.10-15.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification RoHS, UL CE, GS, ISO - - - -
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, South America, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Exceeding;
      Delivery: 24hours~5 Days;
      Service: 7*24 Hours Online;
      Price: Factory Price;
      Keyword: Custom PCB;
      MOQ: 1 PCS;
      Min. Line Spacing: 0.075mm(3mil);
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Min. Line Width: 0.075mm(3mil);
      Min Hole Size: 0.1mm(4mil);
      Testing Service: 100% E-Testing;
      Board Thickness: 0.2-6.0mm;
      Industrial: Industrial Control Board, Motherboard;
      Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
      Solder Mask: Green, White, Black, Blue, Red(Customized);
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Supplier Name

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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