Multilayer PCB

US$0.10-10.00 / Piece

Electronic High Density Printed Circuit-Boards Multilayer Immersion Gold PCB pictures & photos

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What is Electronic High Density Printed Circuit-Boards Multilayer Immersion Gold PCB

Name: Electronic High Density Printed Circuit-Boards Multilayer Immersion Gold PCB
Uploaded: 2025-12-24T14:55:14+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Insulation Materials Epoxy Resin
Brand Exceeding
Transport Package Vacuum
Specification ENIG
Trademark EEG
Origin Made in China
Solder Mask Color Green/Black/White/Red/Blue/Yellow/Purple..etc
Surface Finish HASL/HASL Lead Free, Chemical Tin, Chemical Gold
PCB Material Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers
PCB Shape Rectangular, Round, Slots, Cutouts, Complex
PCB Type Rigid PCB, HDI PCB, Flexible PCB..etc
Certificate ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 4.0/5.0

(1 Reviews)

Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Address Rm1107, Building3, Wisdom Field, Biguiyuan, Xingyiroad, Fuyong Street, Baoan Discrict, Shenzhen City.
Main Markets North America, South America, Western Europe
International Commercial Terms(Incoterms) FOB, CFR, CIF, DDP, DAP, EXW
Terms of Payment T/T, PayPal, Western Union, Small-amount payment, VTB
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Multilayer PCB Comparison

	Electronic High Density Printed Circuit-Boards Multilayer Immersion Gold PCB Contact Now	Stadium Lights PCB with High Conductivity Copper and Thermal Solutions Contact Now	High-Power LED PCB with Heavy Copper for Enhanced Thermal Performance Contact Now	UL Certified Heavy Copper PCB for Industrial LED Lighting Solutions Contact Now	Custom Thermal Management Board for PCB High-Power LED Lighting Applications Contact Now

Transaction Info
	Electronic High Density Printed Circuit-Boards Multilayer Immersion Gold PCB Contact Now	Stadium Lights PCB with High Conductivity Copper and Thermal Solutions Contact Now	High-Power LED PCB with Heavy Copper for Enhanced Thermal Performance Contact Now	UL Certified Heavy Copper PCB for Industrial LED Lighting Solutions Contact Now	Custom Thermal Management Board for PCB High-Power LED Lighting Applications Contact Now
Price	US$0.10-10.00 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Product Certification	ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS	-	-	-	-
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Insulation Materials: Epoxy Resin; Brand: Exceeding; Solder Mask Color: Green/Black/White/Red/Blue/Yellow/Purple..etc; Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold; PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers; PCB Shape: Rectangular, Round, Slots, Cutouts, Complex; PCB Type: Rigid PCB, HDI PCB, Flexible PCB..etc;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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