| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alu;
Base Material: Aluminum/Fr4;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lightintg;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Exceeding;
Surface Finishing: HASL Lf, Enig, OSP, Immersion Au, Silver, Tin;
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 5-10 Days;PCBA, 2-3weeks;
LED Type: 3528/2835/5050/3014/5730/3030;
Thermal Conductivity: 0.8-3W/M.K;
Keyword: LED PCB, Aluminium PCB, Motherboad, Circuit Board;
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Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 2.3mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 175μm;
Tg: 150°c;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 2.3mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 175μm;
Tg: 150°C;
|
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.7mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 170μm;
Tg: 150°C;
|
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.7mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 170μm;
Tg: 150°C;
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