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      PCB
      US$1.00-15.00 / Piece
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      What is Customized Printed Circuit Board HDI Multilayer PCB Manufacturing

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-15.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum
      • Specification Customized
      • Trademark EEG
      • Origin Made in China
      • Board Thickness 0.2-6.0mm
      • PCB Material Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Roger
      • PCB Shape Rectangular, Round, Slots, Cutouts, Complex
      • Copper Thickness 18um-3500um(0.5- 100oz)
      • Surface Finishing Immersion Gold/Silver, HASL Lead Free, Gold Fing
      • Certificate ISO9001, ISO14001, IATF 16949, Ipc-a-610g, Roh

      Product Description

      Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$1.00-15.00 / Piece US$0.90-99.99 / Piece US$0.30-5.00 / pieces US$2.39-5.50 / pieces US$0.50-3.00 / Piece
      Min Order 1 Piece 1 Piece 5 pieces 5 pieces 5 Pieces
      Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification ISO9001, ISO14001, IATF 16949, Ipc-a-610g, Roh - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 0.2-6.0mm;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Roger;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Surface Finishing: Immersion Gold/Silver, HASL Lead Free, Gold Fing;
      Type: Rigid Circuit Board;
      Dielectric: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
      Material: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
      Application: RF;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Enig;
      Base Material: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
      Insulation Materials: PTFE (Polytetrafluoroethylene) + Ceramic Filler (N;
      Brand: Rogers;
      Board Types: Rigid PCB;
      Test: 100% Electrical Test Prior Shipment;
      Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
      Service Area: Worldwide, Globally;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4,Tg,Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/8/12/Custom;
      Copper Thickness: 0.5-6.0oz;
      Min Trace/Gap: 0.075mm or 3mil;
      Silk Scre En Min Line Width: 0.006 or 0.15mm;
      Board Size: Custom;
      PCB Cutting: Shear V-Score, Tab-Routed;
      Board Thickness: 0.2-4.0mm;
      Type: Motherboard PCBA;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Min.Line Snacing: 0.075mm;
      Copper Thickness: 1oz;
      Min. Hole Size: 0.1mm;
      Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.15mm;
      Base Materia: Fr4, Tg;
      Board Thickness: 0.2-4.0mm;
      Surface Finishing: HASL, Lead Free;
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4.Tg.Cem-1,Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Layer: 1-24 Layers;
      Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
      PCB Type: Rigid, Flexible, Rigid-Flexible;
      Board Size: Custom;
      Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
      Min Linewidth/Linespacing: 0.075mm;
      Min Hole Diameter: 0.15mm;
      Board Thickness: 0.2-4.0mm;
      Supplier Name

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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