| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: HB;
Application: Communication;
Metal Coating: Silver;
Layers: Multilayer;
Base Material: Fr-4;
Customized: Customized;
Condition: New;
Mode of Production: SMT&DIP;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 42 Layer;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
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Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Dielectric: Fr4 and Polyimide;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V2;
Application: Consumer Electronics;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Material: Fr4 and Polyimide;
Board Layer: 1-26 Layers;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Max PCB Size: 650*650mm;
Testing: 100%;
Packaging: Carton + Vacuum;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
BGA-Min Pitch: 0.25mm;
PCB Service: One Stop Service;
Dielectric: Fr4 and Polyimide;
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