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      SMT PCB Assembly, DIP PCB Assembly, PCBA Manufacturing

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1,000 Pieces US$0.50-2.50 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Flame Retardant Properties V1
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Model FR-4
      • Brand OEM Design
      • Transport Package Carton Box
      • Trademark EPT
      • Origin China
      • OEM Service Yes
      • PCB Program We Do PCB Program Development

      Product Description

      PCB: Printed circuit board : EPT provides OEM customized PCB assembly service, including SMT and DIN PCBA. We have our own professional electrical engineer to help you on the development and deisgn for your own PCB for different kind of electronic products : PCB for electric home ...

      Learn More

      SMT PCB Comparison
      Transaction Info
      Price US$0.50-2.50 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1,000 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: FR-4;
      Brand: OEM Design;
      OEM Service: Yes;
      PCB Program: We Do PCB Program Development;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Supplier Name

      EP Trend International Co., Ltd.

      Gold Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier