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High - Density Interconnection HDI PCB: Meeting Complex Circuitry Demands pictures & photos

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What is High - Density Interconnection HDI PCB: Meeting Complex Circuitry Demands

Name: High - Density Interconnection HDI PCB: Meeting Complex Circuitry Demands
Uploaded: 2026-01-06T21:19:46+08:00
Description: Model Number PCB-1.1 Type home appliance pcba Place of Origin Guangdong, China Brand Name CRY Copper Thickness 1 oz Supplier Type customized Product name Professional air conditioner inverter pcb bo

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Price

Min. Order Reference FOB Price

1 Piece US$1.00-2.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Gold Plating Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Cry
Transport Package Vacuum Packing
Specification ODM/OEM
Trademark CRY
Origin China

Product Description

Model Number PCB-1.1 Type home appliance pcba Place of Origin Guangdong, China Brand Name CRY Copper Thickness 1 oz Supplier Type customized Product name Professional air conditioner inverter pcb board Application Electronics Device Type Electronic Board Certificate ROSH. ISO9001. ...

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Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 5.0/5.0

(2 Reviews)

Main Products PCB, PCBA, FPC, Fpca, Rigid Flex PCB, Circuit Board, PCB Assemble, MCPCB, Alpcb
Repeat Buyers Choice 80%~100%
Address 1st Floor, Building 5-6, Minfu Road, Shatou Industrial Zone, Shatou Community, Shajing Street, Bao'an District, Shenzhen, Guangdong, China
Main Markets Southeast Asia/ Mideast
Supply Chain Partners 4
Minimum Order Quantity 1 Pc

PCB Comparison

	High - Density Interconnection HDI PCB: Meeting Complex Circuitry Demands Contact Now	Quick View High Quality Fr4 Printed Circuit Board Multilayer PCB Manufacturing HASL Contact Now	L5945atr Brand New Original in Stock Hot Sale Chip IC Component Contact Now	PCBA Factory RoHS Compliant Electronic Manufacturer HDI SMT Contact Now	Quick View Manufacturer with High Quality Custom PCB Circuit Board Contact Now

Transaction Info
	High - Density Interconnection HDI PCB: Meeting Complex Circuitry Demands Contact Now	Quick View High Quality Fr4 Printed Circuit Board Multilayer PCB Manufacturing HASL Contact Now	L5945atr Brand New Original in Stock Hot Sale Chip IC Component Contact Now	PCBA Factory RoHS Compliant Electronic Manufacturer HDI SMT Contact Now	Quick View Manufacturer with High Quality Custom PCB Circuit Board Contact Now
Price	US$1.00-2.00 / Piece	US$0.01-150.00 / Piece	US$0.20-0.60 / Piece	US$0.01-150.00 / Piece	US$0.03-10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, PayPal, Western Union	T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	-	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	ODM, OEM	-	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Shenzhen Chengruyuan Technology Co., Ltd.	Abis Circuits Co., Ltd.	Shenzhen New Chip international Ltd	Abis Circuits Co., Ltd.	Shenzhen New Chip international Ltd
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