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      Copper Substrate PCB
      US$0.10-1.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-1.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper Substrate PCB
      • Insulation Materials Organic Resin
      • Brand Cry
      • Transport Package Vacuum Packing
      • Specification ODM/OEM
      • Trademark CRY
      • Origin China
      • Base Material 1 MCPCB
      • Base Material Thickness 0.8mm-4.0mm
      • Min. Hole Diameter 0.25mm
      • Min. Line Spacing 0.2mm
      • Testing Service 100% Aoi Testing
      • Color Red Blue Green Black White
      • Surface Finishing Enig, HASL, OSP
      • MOQ 1PCS
      • Product Type Metal Core PCB

      Product Description

      Product Description Solder Mask Color Blue.green.red.black.white.etc Material FR4/94v0/Aluminum/cem-1 Cem-3 Keywords Pcb Manufature Surface Treatment Lead HASL Base Material FR-4 Board Size Custom size Shenzhen Chengruyuan Technology Co., Ltd. is a dynamic high-tech printed circuit ...

      Learn More

      Copper Substrate PCB Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$0.10-5.00 / Piece US$1.00-100.00 / Piece US$1.00-100.00 / Piece US$1.00-100.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, Western Union, PayPal, Small-amount payment - LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 3-6 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper Substrate PCB;
      Insulation Materials: Organic Resin;
      Brand: Cry;
      Base Material 1: MCPCB;
      Base Material Thickness: 0.8mm-4.0mm;
      Min. Hole Diameter: 0.25mm;
      Min. Line Spacing: 0.2mm;
      Testing Service: 100% Aoi Testing;
      Color: Red Blue Green Black White;
      Surface Finishing: Enig, HASL, OSP;
      MOQ: 1PCS;
      Product Type: Metal Core PCB;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: PS;
      Quality Test: Aoi, 100% E-Test;
      V- Cut Tolerance: +-10mi;
      Bevel Edge: +-5mil;
      Hole Location Tolerance: +-2mil;
      Hole Diameter Tolerance: +-0.05mm;
      Board Thickness Tolerance: +-5%;
      Line Width/Space Tolerance: +-10%;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Customized;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Layer: 1-32;
      Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
      Max Production Size: 600*800mm;
      Supplier Name

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Ps Electronics Co., Ltd

      Diamond Member Audited Supplier

      KTB Jilin Technology Co., Ltd.

      Gold Member

      KTB Jilin Technology Co., Ltd.

      Gold Member

      KTB Jilin Technology Co., Ltd.

      Gold Member

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