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PCB

US$0.68-3.68 / Piece

10 Layers Embedded System Main Board Multilayer PCB pictures & photos

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What is 10 Layers Embedded System Main Board Multilayer PCB

Name: 10 Layers Embedded System Main Board Multilayer PCB
Uploaded: 2026-01-09T10:43:31+08:00
Description: China Dragon Electronic Industrial Co., LTD. We provide a one-stop service including PCB fabrication, components sourcing and SMT assembly, wave soldering ,burning software,final assembly and funct

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Price

Min. Order Reference FOB Price

1 Piece US$0.68-3.68 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand China Dragon
Transport Package Safe Packing
Specification 8 layers FR4 PCB
Trademark China Dragon
Origin China
Embedded System Embedded System

Product Description

China Dragon Electronic Industrial Co., LTD. We provide a one-stop service including PCB fabrication, components sourcing and SMT assembly, wave soldering ,burning software,final assembly and function testing. 18 Years PCB &PCBA Factory SMT DIP Bare PCB And Electronic Components Assembly ...

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China Dragon Electronic Industrial Co., Limited

Diamond Member Since 2020

Main Products PCB, PCBA, LED Grow Light, PCB Design, Industrial Control, Smart Home, Communications ...
Address B206 Jialingyu Industry Building, Houtingncommunity, Shajing Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, EXW
Terms of Payment LC, T/T, PayPal
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	10 Layers Embedded System Main Board Multilayer PCB Contact Now	Quick View J. G-2104 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View J. G-A17 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Ai-4 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Customized Ai-5 PCBA Solutions for Infrared and Induction Cookers Contact Now

Transaction Info
	10 Layers Embedded System Main Board Multilayer PCB Contact Now	Quick View J. G-2104 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View J. G-A17 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Ai-4 PCBA Customized Service for Infrared Cooker DC Cooker Induction Cooker Contact Now	Quick View Customized Ai-5 PCBA Solutions for Infrared and Induction Cookers Contact Now
Price	US$0.68-3.68 / Piece	US$35.00 / Piece	US$35.00 / Piece	US$35.00 / Piece	US$35.00 / Piece
Min Order	1 Piece	500 Pieces	500 Pieces	500 Pieces	500 Pieces
Payment Terms	LC, T/T, PayPal	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Southeast Asia	North America, South America, Southeast Asia	North America, South America, Southeast Asia	North America, South America, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: China Dragon; Embedded System: Embedded System;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;
Supplier Name	China Dragon Electronic Industrial Co., Limited	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd
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