| Specification |
Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
PCBA Specialised: Consumer, Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Shenzhen Motherboard PCB Flex Circuit Board;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Voltage: Single Phase AC220V;Three Phase 380V;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Protocol: RS485;
Refrigerant: R410;R32;R290;
on-off Input: 8 Channels;
Analog Input: 17 Channels;
Relay Output: 13 Channels;
Communication Interface: 4 Channel RS485;
Expansion Valve Output: 2 Channels;
Water Pump: 3 Channels;
APP Remote Control: Optional;
Function: Cooling;Heating;Hot Water;
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Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
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