| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Profiling: Punchingrouting,V-Cutbeveling;
Price: Factory Direct Price Competitive and Transparent;
Service: One Stop OEM Services Provided;
Application: Communications, Automobile, Consumer Electronics;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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