| Specification |
Metal Coating: Copper;
Mode of Production: SMT and DIP;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-18 Layer;
Copper Thickness: 0.5oz-6oz;
Board Thickness: 0.2mm-4mm;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Consumer, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: PCBA/PCB Assembly/PCB Circuit Board;
Other Service: PCB/PCB Layout and Design, Engineering Support;
PCB Assembly Name: ISO9001 PCB Assembly Control Board PCBA;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
|
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711, Quad-Core Cortex-A72 (Arm V8) 64;
Memory: 8g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50℃;
Package List: 1 X Raspberry Pi 4 Model B (2/4/8GB);
|