| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Other PCBA Service: Conformal Coating;
PCBA Min. Chip Placement: 0201;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Other PCBA Service: Conformal Coating;
PCBA Min. Chip Placement: 0201;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Other PCBA Service: Conformal Coating;
PCBA Min. Chip Placement: 0201;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
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