| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 4GB;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
Coo: UK;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4tg;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min. Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
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Customized: Customized;
Condition: New;
Solder Mask Color: Green, Blue, Yellow, White, Black, Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4,Tg;
Customized: Customized;
Condition: New;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Supplier Type: Manufacturer;
Type: Smart Electronics PCBA;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4.Tg.Cem-1,Aluminium;
Customized: Customized;
Condition: New;
Number of Layers: 8-Layer;
Delivery Detail: 5-10 Working Days;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
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