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      Broadcom Processor Development Board
      Negotiable
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      What is Raspberry Pi 4b 4G Development Board with Broadcom Processor and Dual-Band Wireless

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece Negotiable

      Sepcifications

      • Metal Coating Tin
      • Mode of Production SMT
      • Layers Single-Layer
      • Certification RoHS, CCC
      • Customized Non-Customized
      • Condition New
      • Transport Package Air Express
      • Specification 1 piece/box
      • Trademark CENTURY SOLUTIONS
      • Origin GB
      • Processor Broadcom Bcm2711
      • Memory 4GB
      • Connectivity 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L
      • Coo UK

      Product Description

      Raspberry Pi 4 Computer Model B 4GB RAM Introduction The Raspberry Pi 4 Model B represents the pinnacle of the Raspberry Pi family's evolution. It boasts unprecedented enhancements in processing power, multimedia capabilities, memory, and connectivity compared to its predecessor, the Raspberry Pi ...

      Learn More

      Broadcom Processor Development Board Comparison
      Transaction Info
      Price Negotiable US$0.50-5.00 / pieces US$0.01 / Piece US$1.00-5.00 / pieces US$1.00-5.00 / pieces
      Min Order 1 Piece 5 pieces 1 Piece 5 pieces 10 pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, CCC RoHS, ISO, CE RoHS, CCC, ISO RoHS, ISO, CE RoHS, ISO, CE
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM Own Brand, ODM, OEM - Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Tin;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Customized: Non-Customized;
      Condition: New;
      Processor: Broadcom Bcm2711;
      Memory: 4GB;
      Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless L;
      Coo: UK;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4tg;
      Customized: Customized;
      Condition: New;
      Layer: 1-24 Layers;
      PCB Type: Rigid, Flexible, Rigid-Flexible;
      Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
      Copper Thickness: 0.5-6.0oz;
      Min. Hole Size: 0.1mm;
      Min.Line Spacing: 0.075mm;
      Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
      Min. Line Width: 0.15mm;
      Board Thickness: 0.2-4.0mm;
      Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
      Customized: Customized;
      Condition: New;
      Solder Mask Color: Green, Blue, Yellow, White, Black, Red;
      Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
      Copper Thickness: 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz-10 Oz;
      Layer Count: 1-50 Layers;
      Quality Standard: Ipc Class 2 and Ipc Class 3;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4,Tg;
      Customized: Customized;
      Condition: New;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.15mm;
      Supplier Type: Manufacturer;
      Type: Smart Electronics PCBA;
      Board Thickness: 0.2-4.0mm;
      Surface Finishing: HASL, Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4.Tg.Cem-1,Aluminium;
      Customized: Customized;
      Condition: New;
      Number of Layers: 8-Layer;
      Delivery Detail: 5-10 Working Days;
      Copper Thickness: 0.5-6.0oz;
      Board Size: Custom;
      Board Thickness: 0.2-4.0mm;
      Supplier Name

      CENTURY SOLUTIONS LIMITED

      Gold Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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