| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711;
Memory: 1g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50℃;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Price: Factory Direct Price Competitive and Transparent;
Packaging Details: Vacuumized Packing Insided Inner Package;
Service: One Stop OEM Services Provided;
Supply Ability: 100o00 Piece/Pieces Per Week;
Application: Communications, Automobile,Consumer Electronics;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Price: Factory Direct Price Competitive and Transparent;
Packaging Details: Vacuumized Packing Insided Inner Package;
Service: One Stop OEM Services Provided;
Supply Ability: 100o00 Piece/Pieces Per Week;
Application: Communications, Automobile, Consumer Electronics;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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