| Specification |
Type: Rigid Circuit Board;
Dielectric: RO3210;
Material: Ceramic-Filled, Woven Fiberglass-Reinforced PTFE L;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Gold;
Board Thickness: 0.8mm (Finished);
Layer Count: 2-Layer;
Solder Mask: Green(Top);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,High Tg Fr4,General Tg Fr4middle Tg Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Single Gross Weight: 0.500 Kg;
Copper Thickness: 1oz or Custom;
Packaging Details: Shenzhen One Stop Service OEM Electronic PCB Assem;
Supply Ability: 100000 Piece/Pieces Per Week;
Board Thickness: 1.6mm;
Single Package Size: 20X15X10cm;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Insulation Resin: Epoxy Resin;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min. Line Spacing: Standard;
Hole Spacing: 2.54mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Size: 25mm*15mm;
Copper Thickness: 1oz;
Min. Hole Size: O.1mm;
Board Size: Standard;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.15mm;
Board Thickness: 1.6mm;
Surface Finishing: HASL;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Cem-3,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask: Purple, Green, Red, Blue, Yellow, Black, White etc;
Board Thickness: 0.2-4.0mm;
Min. Line Width: 0.15mm;
Surface Finishing: HASL, Lead Free, Immersion Gold;
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