VIP in Pad PCB Built on 12 Layer with BGA Package

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 210 X 131mm
Trademark Bicheng
Origin China

Product Description

General profile With the development of electronic products to light, thin and small, PCBs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer can not avoid. It is a main part of multilayer PCBs and directly helps to save PCB ...

Learn More

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Prototype Comparison

	VIP in Pad PCB Built on 12 Layer with BGA Package Contact Now	Magnetic Control Switch Cookermore Induction Cooker Contact Now	15kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now	5kw (380V) Main Control Board Spare Parts Induction Cooker Contact Now	5kw Half-Bridge Heating Module Induction Cooker Contact Now

Transaction Info
	VIP in Pad PCB Built on 12 Layer with BGA Package Contact Now	Magnetic Control Switch Cookermore Induction Cooker Contact Now	15kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now	5kw (380V) Main Control Board Spare Parts Induction Cooker Contact Now	5kw Half-Bridge Heating Module Induction Cooker Contact Now
Price	US$9.99 / Piece	US$11.80 / Piece	US$141.00-143.00 / Piece	US$54.00 / Piece	US$55.00 / Piece
Min Order	1 Piece	500 Pieces	100 Pieces	500 Pieces	500 Pieces
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Southeast Asia	North America, South America, Southeast Asia	North America, South America, Southeast Asia	North America, South America, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 0.13;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 2.25;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 0.74;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd
Select All

Contact Now

Hot Search