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      PCB with 94V0
      US$0.90-99.99 / Piece
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      What is Tu-872 Low Dk/Df Fr-4 Multilayer PCB with 94V0 for Superior Thermal Reliability

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.90-99.99 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric Epoxy Fr-4 Resin/Woven Glass
      • Material Tu-872 Slk Sp Laminate
      • Application RF Devices
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology HASL
      • Base Material Tu-872 Slk Sp Laminate
      • Insulation Materials Woven Glass Reinforced Epoxy Composite
      • Brand Iteq/Taiyo
      • Transport Package Express Boxed
      • Specification 400× 500mm
      • Trademark bicheng
      • Origin Shenzhen China
      • Board Types Rigid PCB
      • Test 100% Electrical Test Prior Shipment
      • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
      • Service Area Worldwide, Globally

      Product Description

      (Custom PCBs are tailored products; the images and specifications provided are for reference only.) General Description The TU-872 SLK Sp is a high-performance multilayer printed circuit board (PCB) made from a modified epoxy FR-4 resin. This material is reinforced with advanced woven glass and ...

      Learn More

      PCB with 94V0 Comparison
      Transaction Info
      Price US$0.90-99.99 / Piece US$2.00-5.00 / Piece US$2.00-5.00 / Piece US$2.00-5.00 / Piece US$2.00-5.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Europe Europe Europe Europe
      Annual Export Revenue - 59,508,592 RMB 59,508,592 RMB 59,508,592 RMB 59,508,592 RMB
      Business Model ODM, OEM OEM OEM OEM OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: Epoxy Fr-4 Resin/Woven Glass;
      Material: Tu-872 Slk Sp Laminate;
      Application: RF Devices;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: HASL;
      Base Material: Tu-872 Slk Sp Laminate;
      Insulation Materials: Woven Glass Reinforced Epoxy Composite;
      Brand: Iteq/Taiyo;
      Board Types: Rigid PCB;
      Test: 100% Electrical Test Prior Shipment;
      Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
      Service Area: Worldwide, Globally;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

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