Circuit Board

US$0.90-99.99 / PCS

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What is F4btme300 PCB Printed Circuit Board of Shenzhen PCB Design

Name: F4btme300 PCB Printed Circuit Board of Shenzhen PCB Design
Uploaded: 2025-12-21T22:21:39+08:00
Description: F4BTME300 Base Material, 2-Layer 3.1mm Thick Rigid PCB with Immersion Silver Finish (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. O

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Price

Purchase Qty. Reference FOB Price

1-99 PCS US$99.99

100+ PCS US$0.90

Sepcifications

Type Rigid Circuit Board
Dielectric F4btme300
Material PTFE Resin with Nano-Ceramic Fillers
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Model PCB
Brand Wangling
Transport Package Kk Paper, 3-Layer Wrinkle
Specification 170mm x 95mm=1PCS, ± 0.15mm
Trademark Bicheng
Origin Shenzhen China
Blind Vias None
Board Thickness 3.1mm
Layer Count 2-Layer
Finished Cu Weight 1oz

Product Description

F4BTME300 Base Material, 2-Layer 3.1mm Thick Rigid PCB with Immersion Silver Finish (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overview of this type of PCB This 2-layer rigid PCB, crafted with Wangling F4BTME300 laminate as ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Circuit Board Comparison

	F4btme300 PCB Printed Circuit Board of Shenzhen PCB Design Contact Now	Quick View Enig+OSP Hybrid PCB - 1.2mm Thick Cargo Area Lighting Contact Now	Quick View Lead-Free Double-Sided PCB - Tg150o C High Bay Work Lights Contact Now	Quick View Enepig Surface PCB - Thermoelectric Separation T2 Copper 1.2mm Contact Now	Quick View High-Frequency Fr4 Material PCB - Tg150o C for Sequential Turn Signals Contact Now

Transaction Info
	F4btme300 PCB Printed Circuit Board of Shenzhen PCB Design Contact Now	Quick View Enig+OSP Hybrid PCB - 1.2mm Thick Cargo Area Lighting Contact Now	Quick View Lead-Free Double-Sided PCB - Tg150o C High Bay Work Lights Contact Now	Quick View Enepig Surface PCB - Thermoelectric Separation T2 Copper 1.2mm Contact Now	Quick View High-Frequency Fr4 Material PCB - Tg150o C for Sequential Turn Signals Contact Now
Price	US$0.90-99.99 / PCS	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 PCS	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: F4btme300; Material: PTFE Resin with Nano-Ceramic Fillers; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Model: PCB; Brand: Wangling; Blind Vias: None; Board Thickness: 3.1mm; Layer Count: 2-Layer; Finished Cu Weight: 1oz;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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