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      6 Layer HASL PCB Built on Fr-4 with Green Solder Mask

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.39 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum
      • Specification 180 x 120mm=1PCS
      • Trademark Bicheng Enterprise Limited
      • Origin China
      • Final Foil External 1 Oz
      • Final Foil Internal 1 Oz
      • Final Height of PCB 1.6 mm ±0.16
      • Surface Finish HASL Lead Free
      • Solder Mask Color Green
      • Colour of Component Legend White
      • Mininum Trace (Mil) 6 Mil / 5 Mil
      • Minimum Gap(Mil) 0.3 mm / 4.5 mm
      • Test 100% Electrical Test Prior Shipment

      Product Description

      1.1 General description This is a type of multilayer PCB built on FR-4 substrate with Tg 150° C for the application of Portable PA Systems. It's standard 1.60 mm thick, white silkscreen over green solder mask Covers both sides. The pads are applied with HASL lead free, 5mm strips along both ...

      Learn More

      Multilayer PCB Comparison
      Transaction Info
      Price US$0.39 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T T/T T/T T/T
      Quality Control
      Product Certification - ISO9001,ISO14001,ISO13485,Ts-16949,etc ISO9001,ISO14001,ISO13485,Ts-16949,etc - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Final Foil External: 1 Oz;
      Final Foil Internal: 1 Oz;
      Final Height of PCB: 1.6 mm ±0.16;
      Surface Finish: HASL Lead Free;
      Solder Mask Color: Green;
      Colour of Component Legend: White;
      Mininum Trace (Mil): 6 Mil / 5 Mil;
      Minimum Gap(Mil): 0.3 mm / 4.5 mm;
      Test: 100% Electrical Test Prior Shipment;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

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