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      PCB Board
      US$0.90-99.99 / Piece
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      What is RO4003c 0.5mm 2-Layer PCB Board for RF Electronics

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.90-99.99 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric Rogers RO4003c
      • Material Rogers RO4003c Laminate
      • Application GPS Antennas
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Immersion Silver
      • Base Material Rogers RO4003c Substrate
      • Insulation Materials Rogers RO4003c Substrate
      • Brand Wangling
      • Transport Package Shipping Vacuum Packaging
      • Specification 90.63mm × 170.35mm( ± 0.15m)
      • Trademark bicheng
      • Origin Shenzhen China
      • Board Types Rigid PCB
      • Test 100% Electrical Test Prior Shipment
      • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
      • Service Area Worldwide, Globally

      Product Description

      (Custom PCBs are tailored products; the images and specifications provided are for reference only.) Overview of This Type of PCB The RO4003C 0.5mm 2-layer PCB is a high-performance, ultra-thin circuit board designed for RF applications requiring both excellent electrical performance and ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$0.90-99.99 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece US$30.00-100.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: Rogers RO4003c;
      Material: Rogers RO4003c Laminate;
      Application: GPS Antennas;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersion Silver;
      Base Material: Rogers RO4003c Substrate;
      Insulation Materials: Rogers RO4003c Substrate;
      Brand: Wangling;
      Board Types: Rigid PCB;
      Test: 100% Electrical Test Prior Shipment;
      Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
      Service Area: Worldwide, Globally;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Andriod Pab Board;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Silkscreen: White, Black, Green, Yellow;
      Soldermask: White, Black, Green, Yellow;
      Surface Finishing: HASL;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.2mm;
      Min. Line Width: 0.075mm;
      Min. Line Spacing: 0.075mm;
      Board Thickness: 1.0mm;
      Copper Thickness: 1oz;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Andriod Pab Board;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Silkscreen: White, Black, Green, Yellow;
      Soldermask: White, Black, Green, Yellow;
      Surface Finishing: HASL;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.2mm;
      Min. Line Width: 0.075mm;
      Min. Line Spacing: 0.075mm;
      Board Thickness: 1.0mm;
      Copper Thickness: 1oz;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Copper Thickness: 1oz;
      Surface Finishing: Enig;
      Solder Mask Type: Green;
      Silkscreen: White;
      Board Thickness: 1.6mm;
      Layer: 1 to 18;
      Min. Hole Size: 0.07mm;
      Min.Line Width: 0.1mm;
      Min.Line Spacing: 0.1mm;
      Finishing: Hal, OSP, Immersion;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Surface Finishing: Immersion Gold;
      Solder Mask Type: Green;
      Silkscreen: White;
      Min. Hole Size: 0.2mm;
      Min. Line Width: 0.1mm;
      Min. Line Spacing: 0.1mm;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

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