Buried Via PCB Built on 4 Layer with with BGA and CNC Routing

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Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 60 X 150mm
Trademark Bicheng
Origin China

Product Description

General profile The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone, PDA board etc. Advantages A) Reduce the probability of ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Prototype Comparison

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Transaction Info
	Buried Via PCB Built on 4 Layer with with BGA and CNC Routing Contact Now	Quick View PCBA Assembly Supplier High Density Interconnect SMT Circuit Board Processing Plant Multilayer HDI PCB Contact Now	Quick View Electronics Circuit Board Printing Designer PCBA Inverter Board Assembly Multilayer PCB Contact Now	Quick View PCBA Supplier PCB Circuit Board SMT Processing Manufacturing Assembly Factory Multilayer PCB Contact Now	Quick View Electronics Fr4 PCB Circuit Boards Fabrication PCBA Assembly Manufacturer Supplier Multilayer PCB Contact Now
Price	US$9.99 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T	T/T	T/T	T/T
Quality Control
Product Certification	-	ISO9001,ISO14001,ISO13485,Ts-16949,etc	ISO9001,ISO14001,ISO13485,Ts-16949,etc	ISO9001,ISO14001,ISO13485,Ts-16949,etc	ISO9001,ISO14001,ISO13485,Ts-16949,etc
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Products Name: PCBA Assembly PCB Electronic Motherboard; Layer: Single / Double Sided / Multilayer; Service: PCB/PCBA/PCB Assembly/Electronic Parts; Other Service: Layout Design,Engineering Support,Testing; Specialised: Medical,Industrial,Communication,Controlboard,LED; PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om; Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn; Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz; Min.Hole Size: 0.1mm (4 Mil); Board Thickness: 0.2mm-7mm; Min.Line Spacing: 0.1mm (4 Mil); Solder Color: Green, Red, White, Black,Yellow,Blue; SMT Assembly Line: 10 Lines; Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Products Name: PCBA Assembly PCB Electronic Motherboard; Layer: Single / Double Sided / Multilayer; Service: PCB/PCBA/PCB Assembly/Electronic Parts; Other Service: Layout Design,Engineering Support,Testing; Specialised: Medical,Industrial,Communication,Controlboard,LED; PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om; Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn; Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz; Min.Hole Size: 0.1mm (4 Mil); Board Thickness: 0.2mm-7mm; Min.Line Spacing: 0.1mm (4 Mil); Solder Color: Green, Red, White, Black,Yellow,Blue; SMT Assembly Line: 10 Lines; Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Products Name: PCBA Assembly PCB Electronic Motherboard; Layer: Single / Double Sided / Multilayer; Service: PCB/PCBA/PCB Assembly/Electronic Parts; Other Service: Layout Design,Engineering Support,Testing; Specialised: Medical,Industrial,Communication,Controlboard,LED; PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om; Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn; Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz; Min.Hole Size: 0.1mm (4 Mil); Board Thickness: 0.2mm-7mm; Min.Line Spacing: 0.1mm (4 Mil); Solder Color: Green, Red, White, Black,Yellow,Blue; SMT Assembly Line: 10 Lines; Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Products Name: PCBA Assembly PCB Electronic Motherboard; Layer: Single / Double Sided / Multilayer; Service: PCB/PCBA/PCB Assembly/Electronic Parts; Other Service: Layout Design,Engineering Support,Testing; Specialised: Medical,Industrial,Communication,Controlboard,LED; PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om; Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn; Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz; Min.Hole Size: 0.1mm (4 Mil); Board Thickness: 0.2mm-7mm; Min.Line Spacing: 0.1mm (4 Mil); Solder Color: Green, Red, White, Black,Yellow,Blue; SMT Assembly Line: 10 Lines; Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.
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