Circuit Board

US$0.90-99.99 / Piece

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What is Tu-768 PCB High-Tg and High Thermal Reliability Printed Circuit Board

Name: Tu-768 PCB High-Tg and High Thermal Reliability Printed Circuit Board
Uploaded: 2025-12-21T18:31:32+08:00
Description: (Custom PCBs are tailored products; the images and specifications provided are for reference only.) Brief Introduction The TU-768 and TU-768P laminates/prepregs are constructed from high-quality wov

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Price

Min. Order Reference FOB Price

1 Piece US$0.90-99.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric Tu-768/Woven E-Glass with High-Tg Epoxy Resin
Material Tu-768/Tu-768p Laminate & Prepreg
Application RF Devices
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Immersion Gold
Base Material Tu-768/Tu-768p Laminate & Prepreg
Insulation Materials Epoxy-Based Composite with UV-Blocking Properties
Brand Tuc
Transport Package Vacuum Packed Shipment
Specification 400× 500mm
Trademark bicheng
Origin Shenzhen China
Board Types Rigid PCB
Test 100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
Service Area Worldwide, Globally

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.) Brief Introduction The TU-768 and TU-768P laminates/prepregs are constructed from high-quality woven E-glass coated with an epoxy resin system. This design endows the laminates with UV-blocking ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Circuit Board Comparison

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Transaction Info
	Tu-768 PCB High-Tg and High Thermal Reliability Printed Circuit Board Contact Now	One-Stop PCBA Solution for High Power Lamps - Custom 2 Layer/4 Layer Fr4 PCB with Good Heat Dissipation Contact Now	LED PCB Factory Price Wholesale Copper Clad Board - Professional PCBA Assembly for Various Lighting Applications Contact Now	Free Design LED Lighting Circuit Board - Quality PCBA Manufacturer with Thermal Management and Fast Delivery Contact Now	LED PCBA with Heat Dissipation - Custom Board for Stadium Light, Grow Light and More Contact Now
Price	US$0.90-99.99 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: Tu-768/Woven E-Glass with High-Tg Epoxy Resin; Material: Tu-768/Tu-768p Laminate & Prepreg; Application: RF Devices; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Tu-768/Tu-768p Laminate & Prepreg; Insulation Materials: Epoxy-Based Composite with UV-Blocking Properties; Brand: Tuc; Board Types: Rigid PCB; Test: 100% Electrical Test Prior Shipment; Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc; Service Area: Worldwide, Globally;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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