| Specification |
Type: Rigid Circuit Board;
Dielectric: Tu-883;
Material: Tu-883;
Application: High Speed Digital;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enepig;
Base Material: Tu-883;
Insulation Materials: Tu-883;
Brand: Isola;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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