Multilayer PCB

US$0.90-99.99 / PCS

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What is Rogers RO3010 Multilayer PCB Circuit of Shenzhen PCB Power Amplifier Board

Name: Rogers RO3010 Multilayer PCB Circuit of Shenzhen PCB Power Amplifier Board
Uploaded: 2025-12-21T19:36:42+08:00
Description: 4-Layer Rogers RO3010 Rigid PCB: 2.7mm Thickness with HASL Lead-Free Finish (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overvi

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$99.99

100+ PCS US$0.90

Sepcifications

Type Rigid Circuit Board
Dielectric RO3010
Material Ceramic-Filled PTFE Composite
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Rogers
Transport Package Kk Paper, 3-Layer Wrinkle
Specification 30mm x 30mm
Trademark Bicheng
Origin Shenzhen China
Surface Finish Immersion Gold
Layer Count 4 Layers
Solder Mask No (Top/Bottom)
Silkscreen No (Top/Bottom)

Product Description

4-Layer Rogers RO3010 Rigid PCB: 2.7mm Thickness with HASL Lead-Free Finish (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overview of This Type of PCB This 4-layer rigid PCB, crafted with Rogers RO3010 laminate as the base ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Multilayer PCB Comparison

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Transaction Info
	Rogers RO3010 Multilayer PCB Circuit of Shenzhen PCB Power Amplifier Board Contact Now	USB Charging Module for Power Bank Module Type-C Power Bank PCB Board Module Bank with LCD Screens 5V 6A 20000mAh Contact Now	Quick View China Factory Manufacture Mobile Phone Charger USB PCB PCBA Print Circuit Board Assembly Contact Now	Quick View Quick Turn Air Conditioner Universal PCB Board OEM / ODM Air Conditioner Inverter Universal PCBA Contact Now	Uno R3 Board Atmega328p with USB Cable Contact Now
Price	US$0.90-99.99 / PCS	US$0.78-1.38 / PCS	US$0.59-1.28 / Piece	US$0.58-1.26 / Piece	US$0.80-20.00 / Piece
Min Order	1 PCS	1 PCS	1 Piece	1 Piece	2 Pieces
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	-	-	-	UL(Us&Canada). ISO9001. RoHS, Ts, SGS	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: RO3010; Material: Ceramic-Filled PTFE Composite; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Rogers; Surface Finish: Immersion Gold; Layer Count: 4 Layers; Solder Mask: No (Top/Bottom); Silkscreen: No (Top/Bottom);	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersional Gold; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Ucreate PCB; Board Thickness: 1.2~2.0mm; Surface Finihsing: Immersional Gold; Lead Time: 6-8 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: UC; Board Layer: 6; Board Thickness: 1.6mm; Soldermask Color: Green; Surface Finish: Enig/3u''; Specialities: BGA; Base Material Type: Fr4; Ipc Standards: Ipc Class II; PCB Testing: E-Testing, Flying Probe Testing; Lead Time: 8 Working Days; Fast Turn: 3 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: UC; Board Layer: 6; Material Finished Thickness: 1.6mm; Base: Fr4; Special: High Frequency PCB; Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve; Solder Mask Color: Green/White/Black/Blue/Red; Lead Time: 8 Working Days; PCB Testing: E-Testing, Flying Probe Testing; Fast Turn: 3 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Ucreate PCB Co., Ltd.	Ucreate PCB Co., Ltd.	Ucreate PCB Co., Ltd.	Shenzhen New Chip international Ltd
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