| Specification |
Type: Rigid Circuit Board;
Dielectric: Tsm-Ds3;
Material: Tsm-Ds3;
Application: Couplers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Tsm-Ds3;
Insulation Materials: Tsm-Ds3;
Brand: Unspecified;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Functional Testing;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Paper Phenolic Copper Foil Substrate;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°c;
|
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
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