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      RO4003c PCB
      US$0.99-99.00 / Piece
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      What is RO4003c Double-Sided 32mil Substrate PCB: High-Frequency Board with Green Solder Mask for RF Applications

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$99.00

      100+ Pieces US$0.99

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric RO4003c
      • Material Fiberglass Epoxy
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Hydrocarbon Resin
      • Model PCB
      • Brand Rogers/Taconic/Wangling
      • Transport Package Packing
      • Specification ≤ 400mm X 500mm
      • Trademark Bicheng
      • Origin China
      • Board Types Rigid PCB
      • Test 100% Electrical Test Prior Shipment
      • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
      • Service Area Worldwide, Globally

      Product Description

      RO4003C Double-Sided 0.9mm PCB: High-Frequency Board with 6/5 Mils Trace/Space for RF Applications (All PCBs are custom-manufactured. Specifications may vary based on design requirements.) 1. Overview of This PCB Designed for high-performance RF systems, this double-sided PCB utilizes Rogers ...

      Learn More

      RO4003c PCB Comparison
      Transaction Info
      Price US$0.99-99.00 / Piece US$0.80-2.60 / Piece US$410.21-411.00 / Piece US$0.80-2.60 / Piece US$9,800.00-11,800.00 / Set
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Set
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, Western Union LC, T/T, D/P, PayPal, Western Union T/T, Western Union LC, T/T, D/P
      Quality Control
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others - ISO14001, ISO9001:2015, ISO45001:2018, Others -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic North America Southeast Asia/ Mideast, Domestic Southeast Asia, Mid East, Eastern Asia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM Own Brand, ODM ODM, OEM Own Brand, ODM -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: RO4003c;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Hydrocarbon Resin;
      Model: PCB;
      Brand: Rogers/Taconic/Wangling;
      Board Types: Rigid PCB;
      Test: 100% Electrical Test Prior Shipment;
      Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
      Service Area: Worldwide, Globally;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°c;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: Fan-UC;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°c;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: Xinguanghui;
      Weight: 250kg;
      Power: AC220V;
      Maximum Machining Size: 640*640mm;
      Minimum Machining Size: 50*50mm;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Dulcimer Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Xinguanghui Technology Co., Ltd.

      Gold Member Audited Supplier

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