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      Circuit Board
      US$0.90-99.99 / PCS
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      What is RO4350b Lopro Circuit Board PCB of Shenzhen Bicheng PCB Designer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 PCS US$99.99

      100+ PCS US$0.90

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Hydrocarbon Ceramic Laminates
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Model PCB
      • Brand Rogers
      • Transport Package Kk Paper, 3-Layer Wrinkle
      • Specification ≤ 400mm X 500mm
      • Trademark Bicheng
      • Origin Shenzhen China
      • Thickness 60.7mil
      • Layer Count Double Layer, Multilayer, Hybrid PCB
      • Application Antennas
      • Surface Finish Bare Copper, HASL, Enig, OSP, Immersion Tin etc..

      Product Description

      60.7mil RO4350B LoPro RF PCB Rogers Reverse Treated Foil PCB Circuit Board With Immersion Gold (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) Rogers' proprietary technology is applied in RO4350B LoPro laminates. This technology ...

      Learn More

      Circuit Board Comparison
      Transaction Info
      Price US$0.90-99.99 / PCS US$0.20-0.40 / Piece US$0.10-0.30 / Piece Negotiable US$0.011 / Piece
      Min Order 1 PCS 1 Piece 1 Piece 1 Square Meter 1 Piece
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification - - - - UL, RoHS, SGS, Ect
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Hydrocarbon Ceramic Laminates;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Thickness: 60.7mil;
      Layer Count: Double Layer, Multilayer, Hybrid PCB;
      Application: Antennas;
      Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Silkscreen: White, Black, Red;
      Solder Mask: Green, Yellow, Red, White, Black, Blue;
      Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
      Board Thickness: 0.2-4.0mm;
      Copper Thickness: 0.5oz to 5 Oz;
      Min Hole Size: 0.1mm;
      Min Line Width: 0.075mm;
      Min Line Spacing: 0.075mm;
      Shipping: UPS, FedEx, DHL, Ect;
      Package: Vacuum;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Metal Composite Materials;
      Model: PCB;
      Brand: Xjy;
      Copper Thickness: 1oz;
      Surface Finishing: Immersion Gold;
      Solder Mask Type: Green;
      Silkscreen: White;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.2mm;
      Min. Line Width: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, Fr4;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Surface Finishing: Hf-HASL;
      Copper Thickness: 35um;
      Board Thickness: 1.2mm;
      Min. Hole Size: 0.15mm;
      Min. Line Wigth: 0.25mm;
      Min. Line Spacing: 0.25mm;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Certificates: UL, RoHS, SGS, ISO9001;
      MOQ: 1.6mm;
      Package: Vacuum;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Silkscreen: White, Black, Red;
      Solder Mask: Green, Yellow, Red, White, Black, Blue;
      Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
      Board Thickness: 1.6mm;
      Copper Thickness: 35um;
      Min Line Spacing: 0.2mm;
      Min Line Width: 0.2mm;
      Min Hole Size: 0.25mm;
      Package: Vacuum;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

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