Buried Via PCB Built on 16 Layer with Reliability Test

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Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 201 X 100mm
Trademark Bicheng
Origin China

Product Description

General profile The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone, PDA board etc. Advantages A) Reduce the probability of ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Prototype Comparison

	Buried Via PCB Built on 16 Layer with Reliability Test Contact Now	Quick View Expert PCB Electronics Manufacturing for Aerospace Industry with Advanced Technology Microcontroller RP2040 Contact Now	Quick View PCB Board Size Customized Ultrasound Application 14 Layers Resin Process Circuit Board PCB Contact Now	Quick View High Frequency PCB Manufacturer Factory Customized Service Contact Now	HDI PCB Manufacturing for Compact Devices with High Density Interconnects PCB Board Assembly Contact Now

Transaction Info
	Buried Via PCB Built on 16 Layer with Reliability Test Contact Now	Quick View Expert PCB Electronics Manufacturing for Aerospace Industry with Advanced Technology Microcontroller RP2040 Contact Now	Quick View PCB Board Size Customized Ultrasound Application 14 Layers Resin Process Circuit Board PCB Contact Now	Quick View High Frequency PCB Manufacturer Factory Customized Service Contact Now	HDI PCB Manufacturing for Compact Devices with High Density Interconnects PCB Board Assembly Contact Now
Price	US$9.99 / Piece	US$0.10-1.00 / Piece	US$1.20-1.80 / Piece	US$1.20-1.80 / Piece	US$0.10-1.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	T/T, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: UC; Board Layer: 16; Board Thickness: 3.2mm; Soldermask Color: Green; Surface Finish: Enig/3u''; Specialities: Controlled Impedance; Base Material Type: Fr4; Ipc Standards: Ipc Class II; PCB Testing: E-Testing, Flying Probe Testing; Lead Time: 8 Working Days; Fast Turn: 3 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: UC; Board Layer: 16; Board Thickness: 3.2mm; Soldermask Color: Green; Surface Finish: Enig/3u''; Specialities: Controlled Impedance; Base Material Type: Fr4; Ipc Standards: Ipc Class II; PCB Testing: E-Testing, Flying Probe Testing; Lead Time: 8 Working Days; Fast Turn: 3 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;
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