| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Color: Customized;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Mode of Production: SMT;
Customized: Non-Customized;
Condition: New;
Delivery Time: 1-7days;
MOQ: 1unit;
Part No.1: Kv7-M9283-00X Koganei Bdas16X25-259W Air Cylinder;
Part No.2: Kv7-M9169-00X Brkt Cyl 2 1 for Yv100X Main Stopper;
Part No.3: Kv7-M9169-Oox Brkt Cyl 2 Cylinder;
Part No.4: Kv7-M9237-00X Air Cylinder Pbsa105-W for Yv100X;
Part No.5: Kv7-M9269-02X Pbda10X10-M Cylinder;
Part No.6: Kv7-M9283-00X Ymda1635 Koganei Ymda1635 1W Exit S;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Form Factor: 55mm * 40mm;
Processor: Broadcom Bcm2711;
Input Power: DC 5V;
Operating Temperature: 0 ~ 80℃;
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