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      Circuit Board
      US$0.10 / Piece
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      What is RF Receiver Circuit Board High Frequency Microwave PCB PCBA Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand No
      • Transport Package Vacuum Packaging
      • Specification ISO9001& ISO14001& TS16949 & UL
      • Trademark No
      • Origin Made in China
      • PCB Material Fr4
      • PCB Layer 6
      • PCB Impedance Control No
      • PCB Buried& Blind Vias No
      • PCB Copper Thickness 35um
      • Hard Gold N/a
      • Min Line/Width 6mil
      • Min Drill 0.15mm

      Product Description

      TG170 TG180 RF Receiver Circuit Board High Frequency Microwave PCB Manufacturer 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

      Learn More

      Circuit Board Comparison
      Transaction Info
      Price US$0.10 / Piece US$141.00-143.00 / Piece US$54.00 / Piece US$55.00 / Piece US$6.80 / Piece
      Min Order 1 Piece 100 Pieces 500 Pieces 500 Pieces 500 Pieces
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: No;
      PCB Material: Fr4;
      PCB Layer: 6;
      PCB Impedance Control: No;
      PCB Buried& Blind Vias: No;
      PCB Copper Thickness: 35um;
      Hard Gold: N/a;
      Min Line/Width: 6mil;
      Min Drill: 0.15mm;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 2.25;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.74;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.17;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

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