| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Green;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Sample Date: 3-5days;
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