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      Quick Turn Multilayer Electronic HDI Circuit Board Manufacturer PCB &PCBA Factory

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-10.00 / Piece

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Polyester Glass Fiber Mat Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Brand Abis
      • Transport Package Vacuum Packing
      • Specification 140*120mm
      • Trademark ABIS CIRCUITS
      • Origin Shenzhen, China
      • Copper Thickness 1 Oz
      • Board Layer 1-32 Layers
      • Board Thickness 1.6mm
      • Surface Finish Gold Plating, Enig
      • Solder Mask Blue/Custom
      • Legend White

      Product Description

      Quick Turn Multilayer Electronic HDI Circuit Board Manufacturer PCB &PCBA Factory Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.10-10.00 / Piece US$0.88-0.93 / piece US$0.88-0.93 / piece US$0.88-0.93 / piece US$0.88-0.93 / piece
      Min Order 1 Piece 1 piece 1 piece 1 piece 1 piece
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Copper Thickness: 1 Oz;
      Board Layer: 1-32 Layers;
      Board Thickness: 1.6mm;
      Surface Finish: Gold Plating, Enig;
      Solder Mask: Blue/Custom;
      Legend: White;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Structure: Double-Sided Rigid PCB;
      Dielectric: Fr-3;
      Material: Phenolic Paper Laminate;
      Application: Computer;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Base Material: Fr4;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Structure: Double-Sided Rigid PCB;
      Dielectric: Fr-3;
      Material: Phenolic Paper Laminate;
      Application: Computer;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Base Material: Fr4;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-3;
      Material: Phenolic Paper Laminate;
      Application: Computer;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

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