| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Immersion Gold;
Solder Mask: Green;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: PTFE;
Material: Conventional PTFE-Based Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Conventional PTFE-Based Laminates;
Insulation Materials: PTFE;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Layer Count: Single Sided, Double Sided, Multi-Layer PCB, Hybri;
Copper Weight: 1oz (35µm), 2oz (70µm);
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Application: Microwave;
Thickness: 10 Mil;
Layer: 2-Layer;
Copper Weight: 0.5oz, 1oz or 2 Oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Hydrocarbon Ceramic-Filled Thermoset Materials;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Application: Base Station;
Thickness: 12mil;
Layer Count: 2-Layer;
Surface Finish: Immersion Gold;
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