| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
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Type: Flexible Circuit Board;
Dielectric: Polyimide;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 1;
Board Thickness: 0.15-0.2mm;
Base Material Type: Pi;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Surface Treatment: Enig;
Solder Mask Color: White/Black;
PCB Testing: Flying Probe Testing/E-Testing;
Ipc Standards: Ipc-Class 2;
Lead Time: 7 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Printed Circuit Board Double-Sided PCB Fabrication;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Printed Circuit Board Double-Sided PCB Fabrication;
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