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PCB

US$0.01-20.00 / Piece

Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly pictures & photos

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What is Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly

Name: Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly
Uploaded: 2026-01-09T14:15:46+08:00
Description: Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A profession

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-20.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Medical Instruments
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum Packing
Specification 100*100
Trademark Abis
Origin China
Use Medical Device, Machine, Commication

Product Description

Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly Contact Now	Quick View Factory PCB Manufacturer Flexible Printed Circuit Board Rigid Flex PCB Customized Contact Now	Quick View 20 Layer Rigid -Flex PCB for Medical Equipment Contact Now	Quick View Big Size 8 Layer Rigid-Flex PCB with High Quality Contact Now	Quick View Black Soldmask Rigid-Flex PCB for Printer Contact Now

Transaction Info
	Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly Contact Now	Quick View Factory PCB Manufacturer Flexible Printed Circuit Board Rigid Flex PCB Customized Contact Now	Quick View 20 Layer Rigid -Flex PCB for Medical Equipment Contact Now	Quick View Big Size 8 Layer Rigid-Flex PCB with High Quality Contact Now	Quick View Black Soldmask Rigid-Flex PCB for Printer Contact Now
Price	US$0.01-20.00 / Piece	US$0.50-1.00 / Piece	US$1.00 / Piece	US$1.10-1.70 / Piece	US$2.80-3.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Use: Medical Device, Machine, Commication;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: Uc; Layer: 12; Thickness: 1.5mm; Min Hole: 0.18mm; Surface: Enig; Soldmask: Green; Min Space: 0.15mm; Min Hole Copper: 25um; Hole Qty: 2000; Siz: 250mm300mm;* Used: Power;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: UC; Layer: 20; Thickness: 3.0mm; Min Hole: 0.45mm; Surface: Enig;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: Uc; Layer: 8; Thickness: 2.0mm; Hole: 03mm; Surface: Enig;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: Uc; Layer: 4; Thickness: 0.55mm; Hole: 0.3mm; Surface: Enig;
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