Multi-Layer High-Frequency 4 Layer PCB Thick Copper Plane Winding Mixed Medium Rigid-Flex Circuit Board

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-5.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 200*180mm
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Board Thickness 1.6mm
Copper Thickness 2oz
Surface Finish Immersion Gold
Solder Mask Blue
Legend White/Customized
Layer Muliti-Layer

Product Description

Multi-Layer High-Frequency 4 Layer MCPCB Thick Copper Plane Winding Mixed Medium Rigid-Flex Circuit Board About US Abis Circuits Co., Ltd is a professional PCB manufacturer which was established on Oct, 2006 and focus on double side, Multilayer and HDI pcb mass production. ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Multi-Layer High-Frequency 4 Layer PCB Thick Copper Plane Winding Mixed Medium Rigid-Flex Circuit Board Contact Now	Quick View Fr4 PCB for Sine Wave Inverter with Multilayer Contact Now	Quick View High Quality PCB Board for Mobile Phone with Ce RoHS Contact Now	Quick View Multilayer PCB for USB Keyboard with Green Solder Mask Contact Now	Quick View OEM Bluetooth PCB with Multilayer Green Solder Mask Contact Now

Transaction Info
	Multi-Layer High-Frequency 4 Layer PCB Thick Copper Plane Winding Mixed Medium Rigid-Flex Circuit Board Contact Now	Quick View Fr4 PCB for Sine Wave Inverter with Multilayer Contact Now	Quick View High Quality PCB Board for Mobile Phone with Ce RoHS Contact Now	Quick View Multilayer PCB for USB Keyboard with Green Solder Mask Contact Now	Quick View OEM Bluetooth PCB with Multilayer Green Solder Mask Contact Now
Price	US$0.10-5.00 / Piece	US$0.90-1.50 / PCS	US$0.70-1.20 / PCS	US$0.26-0.53 / PCS	US$2.30-2.90 / PCS
Min Order	1 Piece	1 PCS	1 PCS	1 PCS	1 PCS
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold; Solder Mask: Blue; Legend: White/Customized; Layer: Muliti-Layer;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Board Layer: 10L; Surface Finihsing: Immersion Gold; Lead Time: 6-8 Working Days;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Board Layer: 10L; Surface Finihsing: Immersion Gold; Lead Time: 6-8 Working Days;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Board Layer: 10L; Surface Finihsing: Immersion Gold; Lead Time: 6-8 Working Days;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Uc; Board Layer: 10L; Surface Finihsing: Immersion Gold; Lead Time: 6-8 Working Days;
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