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      1-8 Layers FPC Circuit Board FPC Circuit Board FPC Flexible Circuit Board Customized Fpca

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.01-50.00 / Piece

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide/Pi
      • Combination Mode Adhesive Flexible Plate
      • Application Consumer Electronics,Electronics Device
      • Conductive Adhesive Anisotropic Conductive Adhesive
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Abis
      • Transport Package Vacuum Packing
      • Specification 180*120
      • Trademark Abis
      • Origin China
      • Layer 1-8L
      • Surface Finishing Enig, HASL, Lf-HASL,
      • Board Thickness 1~4 mm
      • Copper Thickness 1oz/2oz
      • Solder Mask Color Green Black Red,Black.Red.Yellow.White.Blue.Green
      • Service One-Stop Service,24hours Technical Services
      • Min. Line Spacing 0.003",0.15mm,0.05 mm
      • Min. Hole Size 0.25mm,0.1mm,6mil

      Product Description

      1-8 layers FPC Circuit Board FPC Circuit Board FPC Flexible Circuit Board Customized Fpca Technical &Capability Item Speci. Layers 1~8 Board Thickness 0.1mm-0.2mm Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan ...

      Learn More

      FPC Comparison
      Transaction Info
      Price US$0.01-50.00 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$2.89 / Piece US$2.50-4.50 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 500 Pieces
      Payment Terms LC, T/T, PayPal, Western Union T/T T/T LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T
      Quality Control
      Product Certification - ISO9001,ISO14001,ISO13485,Ts-16949,etc ISO9001,ISO14001,ISO13485,Ts-16949,etc - -
      Management System Certification - - - - ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe Southeast Asia/ Mideast Domestic
      Annual Export Revenue - - - - -
      Business Model - - - Own Brand ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide/Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Consumer Electronics,Electronics Device;
      Conductive Adhesive: Anisotropic Conductive Adhesive;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 1-8L;
      Surface Finishing: Enig, HASL, Lf-HASL,;
      Board Thickness: 1~4 mm;
      Copper Thickness: 1oz/2oz;
      Solder Mask Color: Green Black Red,Black.Red.Yellow.White.Blue.Green;
      Service: One-Stop Service,24hours Technical Services;
      Min. Line Spacing: 0.003",0.15mm,0.05 mm;
      Min. Hole Size: 0.25mm,0.1mm,6mil;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Double-Sided FPC;
      Material: Polyester Film;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V2;
      Processing Technology: Silk Screen Print;
      Base Material: Polyester Film;
      Insulation Materials: Epoxy Resin;
      Brand: Longstart;
      Ink: Pressure Sensor Ink;
      Thickness: 0.125 mm, 0.175mm;
      Pitch: 0.5 mm to 2.54mm;
      Cable Length: as Per Request;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Dongguan Longstar Technology Co., Ltd.

      Gold Member Audited Supplier

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