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      Customized Multilayer PCB Board Rigid PCB Circuit Board Design for Electronics, Industry, Medical

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.01-100.00 / Piece

      Sepcifications

      • Structure Flush Rigid PCB
      • Dielectric FR-4
      • Material Epoxy Paper Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Additive Process
      • Base Material Copper ,PP
      • Insulation Materials Epoxy Resin
      • Brand Kb,Shenyi,Rogers,Iteq
      • Transport Package Vacuum Packing
      • Specification 70*50 mm
      • Trademark Abis
      • Origin Made in China
      • Layer 1-30 Layers
      • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.
      • Board Thickness 0.20mm-8.00mm
      • Board Outline Tolerance +0.10mm
      • Minimum Line/Space 0.075mm
      • Impedance Control Tolerance +/-10%
      • Surface Finish/Treatment HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

      Product Description

      Customized Multilayer PCB Board Rigid PCB Circuit Board Design for Electronics, Industry, Medical Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$0.01-100.00 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification - RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Flush Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper ,PP;
      Insulation Materials: Epoxy Resin;
      Brand: Kb,Shenyi,Rogers,Iteq;
      Layer: 1-30 Layers;
      Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
      Board Thickness: 0.20mm-8.00mm;
      Board Outline Tolerance: +0.10mm;
      Minimum Line/Space: 0.075mm;
      Impedance Control Tolerance: +/-10%;
      Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Black;
      Size: 35*45mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Black;
      Size: 35*45mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Black;
      Size: 35*45mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Black;
      Size: 35*45mm;
      Package: Vacuum;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

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