Factory Manufacture Wireless Charger PCB Circuit Board Assembly PCBA Video

Name: Factory Manufacture Wireless Charger PCB Circuit Board Assembly PCBA
Uploaded: 2026-01-09T10:24:33+08:00
Description: PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min B

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.20 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Em825
Application Automotive Electronics, Security, Digital Products
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Abis Circuits
Transport Package Vacuum Packaging
Trademark Abis circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
Copper Thickness 2oz
Min Line Width/Space 0.075mm
Surface Finish Enig
Solder Mask Color Green
Layer 2
Board Thickness 2.00mm

Product Description

PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Abis Circuits Comparison

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Transaction Info
	Factory Manufacture Wireless Charger PCB Circuit Board Assembly PCBA Contact Now	Quick View Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly Contact Now	Quick View Customized Electronic SMT DIP Technology One Stop Box Build PCBA PCB Assembly Contact Now	Quick View Electronic Power Bank PCB Assembly with SMT DIP Services Contact Now	Quick View Turnkey Electronic PCB Assembly Service Multi - Layer PCBA for Complex Circuit Designs Contact Now
Price	US$0.10-0.20 / Piece	US$0.98-5.00 / Piece	US$0.65-5.00 / Piece	US$0.76-5.00 / Piece	US$0.56-5.00 / Piece
Min Order	1 Piece	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	LC, T/T, PayPal, Western Union	T/T	T/T	T/T	T/T
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, IATF16949	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	-	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Em825; Application: Automotive Electronics, Security, Digital Products; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis Circuits; Copper Thickness: 2oz; Min Line Width/Space: 0.075mm; Surface Finish: Enig; Solder Mask Color: Green; Layer: 2; Board Thickness: 2.00mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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