| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Abis;
Layer: 1-30 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Functional Application: DIY;
Copper Thickness: 0.5-2.0oz;
Min.Hole Size: 0.25mm;
Min.Line Width: 0.2mm;
Min.Line Spacing: 0.2mm;
Board Thickness: 0.2-3.0mm;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Supplier Type: Manufacturer;
Functional Application: PCBA;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: Double Sided Tin Spraying;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4high Tg Fr4,General Tg Fr4,Middle Tg Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Min.Line Width: 0.15mm;
Min.Hole Size: 0.1mm;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Layer: 1-24 Layers;
Copper Thickness: 0.5-6.0oz;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL;
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