Customized Single/Double/Multilayer Rigid Printed Circuit Board PCBA Assembly PCB Board

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About this Item

Price

Min. Order Reference FOB Price

1 piece US$0.01-50.00 / piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Model FR-4
Brand Abis
Transport Package Vacuum Packing
Specification 250*210mm
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Board Thickness 1.6mm
Copper Thickness 35um
Solder Mask Green or on Your Request
Legend White or on Your Request
Surface Finish HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Product Description

Customized Single/Double/Multilayer Rigid Printed Circuit Board PCBA Assembly PCB Board Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Customized Single/Double/Multilayer Rigid Printed Circuit Board PCBA Assembly PCB Board Contact Now	Quick View High Tg Fr4 Base Material PCB - 1.2mm Thermoelectric Separation OEM Contact Now	Quick View Caf-Resistant Double-Sided PCB - 35μ M Copper Vanity Mirror Lights Contact Now	Quick View High CTI Fr4 Material PCB - 398W/M· K Copper Footwell Lights Contact Now	Quick View ISO9001 Enig Surface PCB - Thermoelectric Separation Reverse Lights Contact Now

Transaction Info
	Customized Single/Double/Multilayer Rigid Printed Circuit Board PCBA Assembly PCB Board Contact Now	Quick View High Tg Fr4 Base Material PCB - 1.2mm Thermoelectric Separation OEM Contact Now	Quick View Caf-Resistant Double-Sided PCB - 35μ M Copper Vanity Mirror Lights Contact Now	Quick View High CTI Fr4 Material PCB - 398W/M· K Copper Footwell Lights Contact Now	Quick View ISO9001 Enig Surface PCB - Thermoelectric Separation Reverse Lights Contact Now
Price	US$0.01-50.00 / piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Model: FR-4; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Solder Mask: Green or on Your Request; Legend: White or on Your Request; Surface Finish: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Model: PCB; Brand: Hongyu; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;
Supplier Name	Abis Circuits Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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