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      Customized Multilayer HDI PCB Board Immersion Gold Circuits Board with Blind and Buried Vias

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 pcs US$0.01-5.00 / pcs

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Auto
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Abis
      • Transport Package Vacuum Packing
      • Specification 240*200
      • Trademark ABIS CIRCUITS CO., LTD
      • Origin Shenzhen, China
      • Layer 1-20 Layers
      • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.
      • Board Thickness 0.20mm-8.00mm
      • Minimum Line/ Space 0.075mm
      • Impedance Control Tolerance +/-10%
      • Surface Finish/Treatment HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

      Product Description

      Customized Multilayer HDI PCB Board Immersion Gold Circuits Board with Blind and Buried Vias Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm ...

      Learn More

      PWB Comparison
      Transaction Info
      Price US$0.01-5.00 / pcs US$1.35-2.16 / Piece US$0.70-5.00 / Piece US$1.28-1.76 / Piece US$0.95-1.33 / PCS
      Min Order 1 pcs 1 Piece 10 Pieces 1 Piece 1 PCS
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
      Quality Control
      Product Certification - - RoHS, CCC, ISO - -
      Management System Certification - - ISO9001:2015 - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - ODM, OEM - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Auto;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 1-20 Layers;
      Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
      Board Thickness: 0.20mm-8.00mm;
      Minimum Line/ Space: 0.075mm;
      Impedance Control Tolerance: +/-10%;
      Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Computer;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: UC;
      Layer: 8;
      Via: 1+6+1;
      Copper: 1/3 Oz;
      Surface: Enig;
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Customized;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: UC;
      Board Layer: 6;
      Board Thickness: 1.6mm;
      Soldermask Color: Green;
      Surface Finish: Enig/3u'';
      Specialities: BGA;
      Base Material Type: Fr4;
      Ipc Standards: Ipc Class II;
      PCB Testing: E-Testing, Flying Probe Testing;
      Lead Time: 8 Working Days;
      Fast Turn: 3 Working Days;
      Type: Flex-Rigid PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Flex-Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: UC;
      Surface Finihsing: Immersion Gold;
      Board Thickness: 1.6mm;
      Lead Time: 6-8 Working Days;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

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