| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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Metal Coating: None;
Mode of Production: Laser Cut;
Layers: Single-Layer;
Base Material: Stainless Steel (Japan 304h-Ta);
Customized: Customized;
Condition: New;
Technology: Laser Cut;
Pattern Range: 600*600 mm;
Maximum Sheet Size: 850*800 mm;
Stencil Thickness(1): 0.08mm,0.1mm,0.12mm.0.13mm,0.15mm;
Stencil Thickness(2): 0.18mm,0.2mm,0.25mm,0.3mm;
Axial Precision: +/-10um;
Resolution: 0.5um;
Edge Roughness: <=3um;
Minimum Aperture: 0.05mm;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Customized: Customized;
Condition: New;
Color: Grey;
Package: 500g/Bottle;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Stainless Steel Shim;
Customized: Customized;
Condition: New;
Foil Thickness: 0.1mm;
Structure: Stencil Foils with Aluminum Frame;
Board Material: Stainless Steel Shim;
Aperture: Laser Cut;
Appearance: Engraving and Electro Polishing;
Fiducial Mark: Through Hole;
Application: Csp, BGA, 0.5mm Qfp etc. Package;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Stainless Steel Shim;
Customized: Customized;
Condition: New;
Foil Thickness: 0.1mm;
Structure: Stencil Foils with Aluminum Frame;
Board Material: Stainless Steel Shim;
Aperture: Laser Cut;
Appearance: Engraving and Electro Polishing;
Fiducial Mark: Through Hole;
Application: Csp, BGA, 0.5mm Qfp etc. Package;
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