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      HDI Shenzhen PCB Shenzhen Electronic Products PCBA Board High Precision PCB Circuit Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-20.00 / Piece

      Sepcifications

      • Structure Flush Rigid PCB
      • Dielectric FR-4
      • Material Epoxy Paper Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Semi-Additive Process
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum Packing
      • Specification 240*200
      • Trademark abis
      • Origin Shenzhen
      • Color Green, Red, Blue, Black, etc.

      Product Description

      HDI PCB Boards Sucessful Cases Show -Definition HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in ...

      Learn More

      Circuit Board Comparison
      Transaction Info
      Price US$0.10-20.00 / Piece US$0.08-0.10 / PCS US$0.08-0.10 / PCS US$0.08-0.10 / PCS US$0.08-0.10 / PCS
      Min Order 1 Piece 1 PCS 1 PCS 1 PCS 1 PCS
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Flush Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Color: Green, Red, Blue, Black, etc.;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Enig;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Uc;
      Board Layer: 10L;
      Surface Finihsing: Immersion Gold;
      Lead Time: 6-8 Working Days;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Enig;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Uc;
      Board Layer: 10L;
      Surface Finihsing: Immersion Gold;
      Lead Time: 6-8 Working Days;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Enig;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Uc;
      Board Layer: 10L;
      Surface Finihsing: Immersion Gold;
      Lead Time: 6-8 Working Days;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Enig;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Uc;
      Board Layer: 10L;
      Surface Finihsing: Immersion Gold;
      Lead Time: 6-8 Working Days;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

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