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      OEM ODM Multilayer Mobile Charger PCB Electronic Rigid-Flex Printed Circuit Board PCBA Motherboard

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-10.00 / Piece

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers 1-20 Layers
      • Base Material Kb
      • Certification UL,ISO9001&ISO14001,SGS,RoHS Report
      • Customized Customized
      • Condition New
      • Transport Package Vacuum Packing
      • Specification Customized
      • Trademark Abis Circuits
      • Origin Shenzhen, China
      • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
      • Board Thickness 0.15-6mm
      • Copper Thickness 1-8 Oz

      Product Description

      OEM ODM Multilayer Mobile Charger PCB Electronic Rigid-Flex Printed Circuit Board PCBA Motherboard 1. Single-sided PCB, double side &multi-layer PCB. 2. CEM-1, FR-4, FR-4 High TG, Aluminum base,Rogers. 3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP,gold plating/finger,Carbon ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.10-10.00 / Piece US$0.01 / Piece US$0.01 / Piece US$0.01 / Piece US$4.00-5.50 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 500 Pieces
      Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification UL,ISO9001&ISO14001,SGS,RoHS Report RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification - - - - ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia
      Annual Export Revenue - - - - -
      Business Model - - - - ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: 1-20 Layers;
      Base Material: Kb;
      Customized: Customized;
      Condition: New;
      Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
      Board Thickness: 0.15-6mm;
      Copper Thickness: 1-8 Oz;
      Metal Coating: Enig / HASL / OSP / Silver etc;
      Mode of Production: SMT / DIP / PCB Manufacturing;
      Layers: From 2 Layers to 50 Layers;
      Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
      Customized: Customized;
      Condition: New;
      Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
      Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
      Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
      Layer Count: 1-50 Layers;
      Quality Standard: Ipc Class 2 and Ipc Class 3;
      Metal Coating: Enig / HASL / OSP / Silver etc;
      Mode of Production: SMT / DIP / PCB Manufacturing;
      Layers: From 2 Layers to 50 Layers;
      Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
      Customized: Customized;
      Condition: New;
      Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
      Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
      Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
      Layer Count: 1-50 Layers;
      Quality Standard: Ipc Class 2 and Ipc Class 3;
      Metal Coating: Enig / HASL / OSP / Silver etc.;
      Mode of Production: SMT / DIP / Customized;
      Layers: From 2 Layers to 50 Layers;
      Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
      Customized: Customized;
      Condition: New;
      Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
      Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
      Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
      Layer Count: 1-50 Layers;
      Quality Standard: Ipc Class 2 and Ipc Class 3;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Copper Thickness: 1oz;
      Board Thickness: Board Thickness;
      Min. Hole Size: 0.15mm--0.25mm;
      Min. Line Width: 0.063mm;
      Min. Line Spacing: 0.063mm;
      Surface Finishing: Lead Free Hal/Enig;
      Layer: 1-24;
      V-Cut Angle: 25 Degree,30degree,45 Degree,60degree;
      Inner Packing: Vacuum Packing,ESD Packing;
      out Packing: Standard Export Carton;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Dongguan Access Star Co., Ltd.

      Gold Member Audited Supplier

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