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Circuit Board

US$0.10 / Piece

Cem1 Cem3 Fr4 Mass Production Competitive Price Printed Circuit Board PCB Board Video

Name: Cem1 Cem3 Fr4 Mass Production Competitive Price Printed Circuit Board PCB Board
Uploaded: 2025-12-22T23:25:34+08:00
Description: CEM1 CEM3 FR4 Mass Production Competitive Price Printed Circuit Board PCB Board 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore)

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Type Rigid Circuit Board
Flame Retardant Properties V0
Dielectric CEM-1
Base Material Copper
Processing Technology Electrolytic Foil
Mechanical Rigid Rigid
Brand Abis
Transport Package Vacuum Packaging
Specification ISO9001& ISO14001& TS16949 & UL
Trademark N/A
Origin Made in China
PCB Material Cem-1
Layer 1
Impedance Control No
Buried& Blind Vias No
Copper 35um
Hard Gold N/a

Product Description

CEM1 CEM3 FR4 Mass Production Competitive Price Printed Circuit Board PCB Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Cem1 Cem3 Fr4 Mass Production Competitive Price Printed Circuit Board PCB Board Contact Now	Quick View 2W/M· K Heat Sink PCB - Auto Signal Lighting Circuit Board OEM Contact Now	Quick View IATF16949 Compliant PCB Factory - Custom 5052 LED Boards Contact Now	Quick View Enig Surface PCB - 5052 Core 2W/M· K for High-Lumen Auto Applications Contact Now	Quick View Automotive Tg130° C Thermal PCB - 5052 Base Material High-Power Lamp Manufacturer Contact Now

Transaction Info
	Cem1 Cem3 Fr4 Mass Production Competitive Price Printed Circuit Board PCB Board Contact Now	Quick View 2W/M· K Heat Sink PCB - Auto Signal Lighting Circuit Board OEM Contact Now	Quick View IATF16949 Compliant PCB Factory - Custom 5052 LED Boards Contact Now	Quick View Enig Surface PCB - 5052 Core 2W/M· K for High-Lumen Auto Applications Contact Now	Quick View Automotive Tg130° C Thermal PCB - 5052 Base Material High-Power Lamp Manufacturer Contact Now
Price	US$0.10 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: CEM-1; Base Material: Copper; Processing Technology: Electrolytic Foil; Mechanical Rigid: Rigid; Brand: Abis; PCB Material: Cem-1; Layer: 1; Impedance Control: No; Buried& Blind Vias: No; Copper: 35um; Hard Gold: N/a;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;
Supplier Name	Abis Circuits Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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