| Specification |
Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Aviation and Aerospace, LED Lighting;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Customized;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Quality: 100% E-Test, Aoi;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Single-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Tkm;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
Exterior: Good Looking;
Touch Feeling: Excellent Touch Feeling;
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Structure: Single-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Tkm;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
Exterior: Good Looking;
Touch Feeling: Excellent Touch Feeling;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Board Thickness: 0.13-0.3mm;
Solder Mask(Coverlay): Yellow, White, Black;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Min.Hole Size: 0.05mm;
Copper Thickness: 0.5oz;
Min.Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
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